In response to the structural characteristics and application environment of system in package ( SiP),temperature shock test is designed and implemented to induce faults,and the failure samples are analyzed by X-ray inspection,sectioning and planar grinding inspection,electron microscope observation. Based on the failure location distribution and corresponding failure characteristics,the failure mechanism is identified as thermal mismatch between different materials,and the reliability weak point of thermal/mechanical stress of the SiP is identified,which provides technical reference for the reliability growth of the similar SiP modules.
system in packagereliabilityfailure analysisthermal mismatch
万方数据
维普
