Research on the Failure Mechanism of CBGA Solder Joints
The failure mechanism of solder joints cracking in ceramic ball grid array (CBGA) after long-term use is studied,and effective measures to improve the reliability of solder joints in such components are put forward. By means of X-ray analysis,micro-section,SEM&EDS,the mechanism and causes of solder joint failure in CBGA packaging devices are studied and analyzed. Based on the failure mechanism,targeted improvement measures are proposed and their effectiveness is verified. The research results indicate that there is a significant difference in thermal expansion coefficient between the CBGA device body and the PCB,which leads to thermal fatigue cracking failure of solder joints after long-term use. And replacing the solder ball type to increase the solder joint height can significantly improve the reliability of solder joints.
万方数据
维普
