首页|润湿天平测试基本原理及相关标准判定解读

润湿天平测试基本原理及相关标准判定解读

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润湿天平测试可以定量评估电子元器件及PCB的可焊性,越来越多的客户要求实验室采用此方法测试样品的焊锡能力,但部分润湿天平相关测试标准的判定存在一定的不合理之处.首先,从理论角度结合杨氏方程介绍了理论润湿力计算依据,并详细地介绍了润湿曲线的物理含义;然后,整理了几种润湿天平测试标准的判定要求,指出了EIA/IPC/JEDEC J-STD-002E和IPC J-STD-003C-WAM1&2标准中关于理论润湿力计算过程里忽略不润湿部分对润湿力的影响的错误做法,以及GJB 360B—2009标准中采用参考润湿力评估样品可焊性时的不合理之处并给予了修正建议;最后,提出了其他相关文献的不合理之处.
Interpretation of the Basic Principle of Wetting Balance Testing and Relevant Standards Judgment
Wetting balance testing can quantitatively evaluate the solderability of electronic components and PCBs. More and more customers request laboratories to use this method to test the soldeability of samples. However,there are certain unreasonable aspects in the judgment of some testing standards related to wetting balance. Firstly,the basis for calculating the theoretical wetting force is introduced from a theoretical perspective combined with Young' s equation,and the physical meaning of the wetting curve is introduced in detail. Subsequently,the judgement requirements of several wetting balance test standards are summarized,the erroneous practice of neglecting the influence of non-wetting parts on the wetting force in the calculation process of theoretical wetting force in EIA/IPC/JEDEC J-STD-002E and IPC J-STD-003C-WAM1&2 standards,as well as the unreasonable aspect of using reference wetting force to evaluate the wettability of samples in the GJB 360B—2009 standard is pointed out,and correction suggestion is given. Finally,the unreasonable points of the related literature is proposed.

wetting balance testsolderability evaluationwetting curvesYoung's equationcrieteria

高海龙、吴飞、钱旺

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工业和信息化部电子第五研究所华东分所,江苏 苏州 215000

润湿天平 可焊性测试 润湿曲线 杨式方程 标准判定

2024

电子产品可靠性与环境试验
工业和信息化部电子第五研究所(中国电子产品可靠性与环境试验研究所) (中国赛宝实验室)

电子产品可靠性与环境试验

影响因子:0.438
ISSN:1672-5468
年,卷(期):2024.42(5)