With the rapid development of electronic packaging technology,as an important metal to metal connection method,gold-aluminum bonding process has been widely used in the manufacturing process of electronic devices.However,the lifetime of the gold-aluminum bonding interfaces is degraded in high temperature environments,which directly affects the stability and lifetime of the entire electronic system.High temperature accelerated lifetime tests at different temperatures are designed,and the bonding interface behavior of gold-aluminum bonding at different time conditions is compared and analyzed,the degradation law of mechanical properties of gold-aluminum bonding solder joints is studied.At the same time,the lifetime stress model of the characteristic lifetime and absolute temperature of the gold-aluminum bonding solder joint is constructed by using the Arrhenius model,and the characteristic lifetimes of solder joints in the non-operating state and operating state are predicted according to the lifetime stress model respectively.
关键词
封装技术/金铝键合/高温加速寿命试验/寿命模型
Key words
packaging technology/gold-aluminum bonding/high temperature accelerated lifetime test/lifetime model
维普
万方数据