摘要
半导体器件的快速发展对封装互连材料提出了更高的要求.微纳铜材料具有良好的导电、导热和机械性能.与常用的微纳银相比,微纳铜具有更强的抗电迁移能力和更低的成本,在封装互连领域被广泛应用.微纳铜材料的制备方法可分为化学法、物理法、生物法3类,其中化学液相还原法以低成本、高可控、工艺简单等优势占据重要地位.不同的封装互连工艺步骤需要不同形貌的微纳铜颗粒.微纳铜材料在封装互连中主要应用于芯片固晶、Cu-Cu键合、细节距互连等工艺,探讨了微纳铜材料在以上工艺中的应用,并对微纳铜材料在封装互连中的应用进行了展望.
Abstract
The rapid development of semiconductor devices has put forward higher requirements for package interconnection materials.Micro-nano copper material has good electrical,thermal and mechanical properties.Compared with the commonly used micro-nano silver,micro-nano copper has stronger resistance to electromigration and lower cost,and micro-nano copper is widely used in the field of package interconnection.The preparation methods of micro-nano copper materials can be divided into three categories:chemical method,physical method,and biological method,among which the chemical liquid-phase reduction method occupies an important position with the advantages of low cost,high controllability,and simple process.Different package interconnection process steps require micro-nano copper particles with different morphologies.Micro-nano copper materials are mainly used in processes such as chip solidification,Cu-Cu bonding,and fine pitch interconnection in package interconnection,the applications of micro-nano copper materials in the above processes are discussed,and the applications of micro-nano copper materials in package interconnection are prospected.
维普
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