Preparation of Micro-Nano Copper Material and Its Applications in Package Interconnection
The rapid development of semiconductor devices has put forward higher requirements for package interconnection materials.Micro-nano copper material has good electrical,thermal and mechanical properties.Compared with the commonly used micro-nano silver,micro-nano copper has stronger resistance to electromigration and lower cost,and micro-nano copper is widely used in the field of package interconnection.The preparation methods of micro-nano copper materials can be divided into three categories:chemical method,physical method,and biological method,among which the chemical liquid-phase reduction method occupies an important position with the advantages of low cost,high controllability,and simple process.Different package interconnection process steps require micro-nano copper particles with different morphologies.Micro-nano copper materials are mainly used in processes such as chip solidification,Cu-Cu bonding,and fine pitch interconnection in package interconnection,the applications of micro-nano copper materials in the above processes are discussed,and the applications of micro-nano copper materials in package interconnection are prospected.
万方数据
维普
