Study on the Effect of IMC Thickness on Thermal Fatigue Life of Hybrid Solder Joints
The fatigue life of solder joints is a key indicator of its long-term reliability.The thickness of the intermetallic compound(IMC)has a significant effect on the fatigue life of solder joints.The effect of IMC thickness on the fatigue life of hybrid solder joints under thermal cycling conditions is investigated.The results show that the thermal fatigue life of solder joints decreases continuously with the increase of IMC thickness.In addition,the distribution of stress and strain in solder joints is less affected by IMC thickness,but their values increase with the increase of IMC thickness.Meanwhile,the plastic strain increases with the increase of IMC thickness.A logarithmic relationship between the thermal fatigue life of hybrid solder joints and IMC thickness is obtained based on the Coffin-Manson model.
hybrid solder jointintermetallic compoundthermal cyclingfatigue life
万方数据
维普
