Research on the Packaging Process of High-Density Digital SiP Applications
For high-density digital system in packaging(SiP)applications,adopting the multi-chip integrated packaging technology,and the digital signal processor(DSP)and peripheral DDR3,SPI Flash,Nor Flash,Nand Flash,and low-dropout linear regulator(LDO)chips are integrated in the system,and the high speed interconnection between the chips is realized based on the high-density ceramic packaging substrate and the surface multi-layer thin film process.In addition,the reconfiguration of the DDR chip from wire bonding to flip chip packaging has been completed by using the non-silicon through via interposer process,which ensures the transmission distance while minimizing the chip packaging size.A minimal system with digital signal processing functions is realized within a packaging size of 35 mm×40 mm.The technologies involved are general basic technologies that can be widely used in other high-density packaging products.
万方数据
维普
