Constant temperature environment and stable current injection are essential conditions for the stable operation of semiconductor lasers.The traditional thermostatic control system and light source current drive system consist of discrete components such as voltage reference source,operational amplifier,power transistor,MOSFET,and so on.The employment of numerous discrete components adds complexity to circuit designs and leads to low reliability.Technology of system in package(SiP)is utilized to realize high-density integration of the thermostatic control system and light source current drive system,realizing a miniaturized,integrated,and low-cost design.Through system-level circuit and thermal simulation analysis,the reliability of the device design is ensured.According to the test results,the parameters of the device can meet the requirements.
关键词
系统级封装/半导体激光器/恒温控制/驱动电流
Key words
system in package/semiconductor laser/thermostatic control/driving current
维普
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