Laser Parallel Scanning Sintering Forming Technology for Conductive Structures Based on Nano Copper Paste
Aiming at the rapid prototyping of conductive structures in flexible substrates,the multi-channel laser parallel scanning sintering technology of nano copper paste is optimized.The effects of different power and filling spacing on the sintering morphology and resistivity of nano copper paste during laser sintering process are investigated,and the best process parameters are obtained.Proper reduction of the spacing can improve the sintering degree and electrical conductivity,but too small spacing can easily lead to overheating of the substrates.The experimental results show that the optimal combination of parameters is a power of 170 mW,a spacing of 10 μm and a spot diameter of 15 μm,at this time,the sintered wire presents a metallic copper color and forms a reticulated sintering structure,and the measured resistivity is 5.32×10-6 Ω·cm.The effects of polyimide(PI)and polyethylene terephthalate(PET)films in laser sintering process are compared,and the influence mechanism of heat resistance and transparency of substrate on sintering effect is analyzed,which provides the feasible reference for the subsequent cleaning process.
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维普
