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真空共晶焊接技术研究

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介绍了真空共晶焊接的优势.应用真空共晶焊炉研究了影响焊接质量的主要工艺参数:焊接气氛、焊接温度、焊接时间和压力等.从试验得出,在真空环境进行共晶焊接,可有效抑制氧化物的产生,降低空洞率,提高焊接质量,并可实现多元件一次性焊接,极大地提高焊接效率.提出了可行的低空洞率焊接工艺方案.
Research of Vacuum Eutectic Soldering Technology
Introduce the advantages of vacuum eutectic soldering technology. The main process parameters of affecting the eutectic soldering quality were studied using vacuum eutectic solder machine, including soldering atmosphere, soldering temperature, soldering time, pressure and so on. It is approved that vacuum eutectic soldering can effectively restrain the oxide, reduce the rate of void, improve soldering quality, can solder several dies at same time, and greatly improve the efficiency of soldering. Put forward the feasible solution with vacuum eutectic soldering to achieve low void rate.

eutectic solderingvacuumvoid

庞婷、王辉

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中国电子科技集团公司第二十九研究所,四川 成都 610036

共晶焊接 真空 空洞

2017

电子工艺技术
中国电子科技集团公司第二研究所

电子工艺技术

影响因子:0.328
ISSN:1001-3474
年,卷(期):2017.38(1)
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