不可展开曲面电路图形与电阻一体化成型方法
Integrated Fabrication of Conformal Circuit Patterns and Resistors on Non-Developable Surfaces
蒋瑶珮 1方杰 1崔西会1
作者信息
- 1. 中国电子科技集团公司第二十九研究所,成都 610036
- 折叠
摘要
基于激光微熔覆和三维直写技术,提出了一种在不可展开曲面上实现电路图形与电阻一体化成型的方法.通过激光粗化增强基材表面结合力,随后采用喷墨直写生成导电图形和曲面电阻,并利用激光固化成型.试验结果显示,该工艺制备的电阻在恒温放置、温度变化和热稳定性试验中表现出良好的稳定性,同时镀层附着力满足应用要求.该技术提高了电阻和电路的集成可靠性,简化了工艺流程,特别适用于复杂曲面结构中的共形天线设计,具备广阔的应用前景.
Abstract
Using laser micro-cladding and three-dimensional direct writing technology,a method for integrated fabrication of circuit patterns and resistors on non-developable surfaces is proposed.Laser roughening enhances the bonding strength of the substrate surface,followed by inkjet printing to generate conductive patterns and curved resistors,with laser curing for final shaping.The test results indicate that the resistors produced by this process exhibit excellent stability in constant temperature,thermal cycling,and thermal stability tests,while the coating adhesion meets application requirements.This technology improves the integration reliability of resistors and circuits,simplifies the manufacturing process,and holds broad application potential,especially in conformal antennas for complex curved structures.
关键词
共形电路/电阻/一体化/可靠性Key words
conformal circuit/resistor/integration/reliability引用本文复制引用
出版年
2025
NETL
NSTL
万方数据