电子工艺技术2025,Vol.46Issue(1) :7-10.DOI:10.14176/j.issn.1001-3474.2025.01.003

表贴热保护型瞬态抑制二极管器件的设计应用

Design and Application of Surface Mounted Thermal Protection Transient Suppression Diode Components

孙磊 李浩 聂中明 统雷雷 王世堉 邱华盛
电子工艺技术2025,Vol.46Issue(1) :7-10.DOI:10.14176/j.issn.1001-3474.2025.01.003

表贴热保护型瞬态抑制二极管器件的设计应用

Design and Application of Surface Mounted Thermal Protection Transient Suppression Diode Components

孙磊 1李浩 2聂中明 1统雷雷 2王世堉 1邱华盛1
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作者信息

  • 1. 中兴通讯股份有限公司,广东 深圳 518057
  • 2. 中兴通讯(南京)有限责任公司,南京 211161
  • 折叠

摘要

热保护型瞬态抑制二极管(TTVS)通常被用作防止雷击等异常大电流的保护器件,在通讯基站电源系统中广泛应用.该类器件一般都是以插件封装形式出现,通过通孔焊接方式安装到PCB上.全表面贴需求的提出,不但意味着器件封装形式的改变;而且在性能上既要能在加工中耐受回流焊的温度,保证引脚焊接良好的情况下内部线路不熔断,又要在使用过程中有电流冲击温度上升的情况下保证内部电路及时脱扣断开,确保设备安全.目前在行业内还没有成熟应用的先例.在器件设计导入阶段,工艺工程师与产品设计师、器件设计师充分协作,经过多次试验和验证,在器件内部材料、导热通道设计、器件工艺性保证、加工工艺优化等方面进行了大量的改进,最终实现了表贴TTVS器件在通讯站大型电路板上的成功应用.

Abstract

The TTVS is usually used as a protection component to prevent lightning strikes and other abnormal large current.It is widely used in the power supply system of communication base stations.Such components are usually packaged with plug-ins,and are installed on the PCB through through-hole soldering.The full-surface mounting requirements are proposed,the requirements means that the component packaging form is changed,in addition,the performance shall be able to withstand the temperature of reflow soldering during processing,ensure that pins are soldered well,internal circuits are not fused,and ensure that internal circuits are tripped and disconnected in a timely manner when the current surge temperature rises during use,so as to ensure equipment safety.There is no mature application precedent in the industry.In the component design introduction phase,the process engineer collaborates fully with the product designer and component designer.After multiple tests and verifications,a large number of improvements are made in the internal materials of the component,thermal channel design,component process assurance,and process optimization.Finally,the successful application of the surface-mounted TTVS component on the large circuit board of the communication station is achieved.

关键词

TTVS/表贴/脱扣/熔断

Key words

TTVS/surface mounting/tripping/fusing

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出版年

2025
电子工艺技术
中国电子科技集团公司第二研究所

电子工艺技术

影响因子:0.328
ISSN:1001-3474
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