基于PSAP工艺的精细线路制作
Fine Line Production by PSAP Process
付海涛 1王俊涛 1王昌水1
作者信息
- 1. 上海美维科技有限公司,上海 201613
- 折叠
摘要
随着电子器件日益轻薄化、微型化,集成电路封装基板及印制电路板的线路精细程度不断提升.采用PSAP工艺,使用常规的除胶渣和化学铜药水情况下可以制作15 μm/15 μm精细线路.在PSAP工艺制程中发现盲孔孔底裂缝的问题,对不同的层压前处理药水体系和不同的半固化片进行全排列试验,结果显示层压前处理药水体系是影响盲孔孔底裂缝的主要因素,选择T型药水可以解决盲孔孔底裂缝的问题.
Abstract
With the increasing thinness and miniaturization of electronic devices,the line precision of IC substrates and printed circuit boards continues to improve.The PSAP process is adopted to make the 15 µm/15 µm fine circuit under the condition of using conventional Desmear and PTH solution.In addition,the problem of cracks at the bottom of blind via is found in the PSAP process.The full array experiments are carried out on the chemical of pretreatment and the type of prepreg.The experimental results show that the chemical of pretreatment is the main factor affecting the cracks,and the selection of T type chemical can solve the problem of cracks.
关键词
PSAP/PCF/精细线路Key words
PSAP/PCF/fine line引用本文复制引用
出版年
2025
NETL
NSTL
万方数据