厚膜混合集成电路用互联引线材料的选型
Selection of Interconnecting Lead Materials for Thick Film Hybrid Integrated Circuit
吕晓云 1黄栋 1史海林 1王亚莉 1张潇珂 1郑毅 1史凤 1姚金实 1朱玉倩1
作者信息
- 1. 西安微电子技术研究所,西安 710100
- 折叠
摘要
厚膜混合集成电路模块内引线与基板间需要实现电连接并承载一定的电流,目前主要采用金属连接互联引线通过焊接的方式实现,功率器件的电引出也需要借助金属互联引线.铜或铜合金的导热导电性能良好,加工性能优异,成本相对较低,是作为集成电路用金属互联引线的首选材料.选用纯铜、白铜、黄铜、锡青铜和铍青铜合金作为金属互联引线材料,从微观角度验证这5种金属引线材料与厚膜混合集成电路焊接工艺的兼容性.研究得出,在不需要进行机械支撑的场合,混合集成电路选用纯铜作为金属互联引线材料最佳,对互联材料有强度要求时建议选择锡青铜合金.
Abstract
It is necessary to realize electrical connection and carry a certain current between the lead and the substrate in the thick film hybrid integrated circuit module.Currently,the connection of lead wire and substrate mainly achieved by welding the metal interconnecting lead,and the power device electrical extraction also needs to use the metal interconnecting lead.Copper or copper alloy has good thermal and electrical conductivity,excellent processing performance,and low cost,so it is the preferred material for metal interconnecting lead used in integrated circuits.Pure copper,cupronickel,brass,tin bronze and beryllium bronze alloys are selected as metal interconnect lead materials to verify the compatibility of these five metal lead materials with the welding process of thick film hybrid integrated circuits from a microscopic point of view.The research shows that in the occasions without mechanical support,pure copper is the best choice of martial connection for hybrid integrated circuit,and tin-bronze alloy is recommended when the strength of scaffold material is required.
关键词
厚膜混合集成电路/金属互联引线/铜合金/纯铜/锡青铜Key words
thick film hybrid integrated circuit/metal connection bracket/copper alloy/pure copper/tin-bronze alloy引用本文复制引用
出版年
2025
NETL
NSTL
万方数据