混合键合剪切强度的影响因素
Influencing Factors of Hybrid Bonding Shear Strength
贺京峰 1张京辉2
作者信息
- 1. 贵州振华风光半导体股份有限公司,贵阳 550018
- 2. 中国运载火箭技术研究院,北京 100076
- 折叠
摘要
对混合键合产品中可靠性评价之一的剪切强度影响因素进行了阐述,重点从混合键合界面材料和键合工艺条件两个方面介绍了材料与工艺因素对混合键合产品剪切强度的影响,并对国内外研究中混合键合界面材料的铜晶粒结构、介电层种类和混合键合工艺条件的界面活化、界面钝化层保护、退火处理对混合键合强度的影响进行了评述,总结了近年来混合键合界面材料与键合工艺对键合剪切强度的影响研究进展.最后,对特定晶粒取向的铜与聚合物介电层在混合键合工艺中表现出的剪切强度优势进行了分析总结,并对混合键合未来发展方向进行了展望.
Abstract
The influencing factors of shear strength,one of the reliability evaluations in hybrid bonding products are briefly introduced.The influence of material and process factors on the shear strength of hybrid bonding products is emphatically introduced from two aspects:hybrid bonding interface materials and bonding process conditions.The influence of hybrid bonding interface materials such as copper grain structure,dielectric layer types,and hybrid bonding process conditions such as interface activation,interface passivation layer protection,and annealing treatment on hybrid bonding strength both home and abroad research are reviewed.The recent research progress on the influence of hybrid bonding interface materials and bonding processes on bonding shear strength are summarized.Finally,the shear strength advantages exhibited by copper with specific grain orientations and polymer dielectric layers in hybrid bonding processes are analyzed and summarized,and the future development direction of hybrid bonding is prospected.
关键词
混合键合/剪切强度/界面材料/界面活化/热处理Key words
hybrid bonding/shear strength/interface material/interface activation/heat treatment引用本文复制引用
出版年
2025
NETL
NSTL
万方数据