晶圆键合台的力反馈方法
Force Feedback Method of Wafer Bonding Platform
陈慧玲 1周字涛 2王成君 3张辉 2张慧2
作者信息
- 1. 江苏第二师范学院计算机工程学院,南京 210013
- 2. 东南大学机械工程学院,南京 211189
- 3. 中国电子科技集团公司第二研究所,太原 030024
- 折叠
摘要
在半导体晶圆键合工艺中,两晶圆在承载台推力作用下产生形变从而键合,其中受力方式为点接触或线接触,存在受力不均匀的问题.基于神经网络模糊PID先进算法,进行了晶圆键合台力反馈控制方法研究;采用STM32单片机作为键合台的主控,以及UART串口通信协议与上位机通信.为了验证该控制算法应用于晶圆键合台系统的优越性,利用Matlab软件构建了算法仿真模型,并与试验测定值进行了比较.结果显示起步阶段的键合压力理论值与测定值变化规律一致,当施加压力值到达目标设定位附近上下波动,最终与理论仿真的键合力一同稳定在目标值.
Abstract
In the semiconductor wafer bonding process,two wafers are deformed and bonded under the thrust of the bearing platform.The force mode is point contact or line contact,which has the problem of uneven force.Therefore,based on the advanced neural network fuzzy PID algorithm,the feedback control method of wafer bonding platform is studied.STM32 singlechip microcomputer is used as the main control of the bonding platform,and UART serial communication protocol is utilized to communicate with the host computer.In order to verify the superiority of the control algorithm applied to the wafer bonding platform system,the simulation model is constructed by Matlab,which is compared with the experimental values.The results show that the theoretical values of bonding pressure in the initial stage are consistent with the measured values.When the applied pressure reaches the target setting point,it fluctuates up and down,and finally stabilizes at the target value with the theoretical bonding force.
关键词
半导体/键合压力/反馈控制Key words
semiconductor/bonding force/feedback control引用本文复制引用
出版年
2025
NETL
NSTL
万方数据