引起印制电路板ICD失效的关键要素(待续)
Key Elements of PCB ICD Failure
毕文仲 1徐伟明 1曾福林 1安维1
作者信息
- 1. 中兴通讯股份有限公司,广东 深圳 518057
- 折叠
摘要
从印制电路板ICD问题定义和缺陷类型展开分析,设计试验方案,验证ICD问题关键要素和产生的机理,从设计、板材、钻孔、去钻污、孔金属化5个方面分析验证,得出验证结果,提出改善预防措施,为PCB从业者提供借鉴.
Abstract
From the analysis of ICD problems and defect types of PCB,the test scheme is designed to verify the key elements and generation mechanism of ICD problems.Analysis and verification from five aspects of design,materials,drilling,dirt removal and hole metallization,verification results are obtained,and preventive measures are proposed to provide reference for PCB practitioners.
关键词
ICD/高速板材/钻孔/去钻污Key words
ICD/high-speed materials/drilling/dirt removal引用本文复制引用
出版年
2025
NETL
NSTL
万方数据