电子工业专用设备2024,Vol.53Issue(1) :1-5.

福建省碳化硅衬底专利技术现状与发展建议

Patent Technology Status and Development Suggestions of Silicon Carbide Substrate in Fujian Province

许鲜
电子工业专用设备2024,Vol.53Issue(1) :1-5.

福建省碳化硅衬底专利技术现状与发展建议

Patent Technology Status and Development Suggestions of Silicon Carbide Substrate in Fujian Province

许鲜1
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作者信息

  • 1. 福建省知识产权保护中心,福建 福州 350108
  • 折叠

摘要

以碳化硅、氮化镓为代表的宽禁带半导体材料,已经成为国际半导体研究和产业化的热点.以碳化硅衬底技术专利活动情况为研究目标,从专利申请趋势、专利地域分布、主要申请人和技术领域分布等角度进行对比分析,梳理专利布局优势和存在的问题,提出福建省碳化硅衬底技术专利布局优化和质量提升的对策建议,全面助力福建省碳化硅衬底技术优化升级.

Abstract

Wide band gap semiconductor materials,represented by silicon carbide and gallium nitride,have become a hot spot in international semiconductor research and industrialization.This paper takes silicon carbide substrate technology patent activities as the research objective,makes a comparative analysis from the perspectives of patent application trend,patent geographical distribution,main applicants and technology field distribution,sorts out the advantages and existing problems of patent layout,and puts forward countermeasures and suggestions for the optimization and quality improvement of silicon carbide substrate technology patent layout in Fujian Province,Fully help Fujian Province silicon carbide substrate technology optimization and upgrading.

关键词

碳化硅衬底/宽禁带半导体/第三代半导体/专利分析/专利布局

Key words

Silicon carbide substrate/Wide bandgap semiconductor/Third generation semiconductor/Patent analysis/Patent layout

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基金项目

2022年度福建省市场监督管理局科技项目(FJMS2022030)

出版年

2024
电子工业专用设备
中国电子科技集团公司第四十五研究所

电子工业专用设备

影响因子:0.157
ISSN:1004-4507
参考文献量9
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