According to process requirement of users,the working principle of motion control module and the sub-module of bonding head of full-automatic chip bonding equipment are analyzed,the motion control system based on S-shaped velocity curve is designed,and the motion path of bonding head is redesigned according to the s-shaped velocity curve,and shortening the chip bonding cycle while ensuring its bonding accuracy.
关键词
运动控制模块/键合头/S形速度曲线
Key words
Motion control module/Bonding head/S-shaped speed curve
维普
万方数据