Research and Analysis of Bonding Head Motion Control Based on S-shaped Speed Curve
According to process requirement of users,the working principle of motion control module and the sub-module of bonding head of full-automatic chip bonding equipment are analyzed,the motion control system based on S-shaped velocity curve is designed,and the motion path of bonding head is redesigned according to the s-shaped velocity curve,and shortening the chip bonding cycle while ensuring its bonding accuracy.
Motion control moduleBonding headS-shaped speed curve
万方数据
维普
