Wafers with cleavage surfaces are prone to damage at the wafer end face during cleavage.In order to reduce the damage during wafer cleavage,design a set of equipment for wafer cleavage processing by utilizing the characteristics of wafer materials,reducing the end face damage during wafer cleavage.The experimental results show that the device can obtain non-destructive,undamaged,and smooth cleavage surfaces during wafer cleavage processing.
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维普
