A Positioning and Edge Inspection Method Applied to Silicon Carbide Grinding Machines
For silicon carbide wafers with flat edges,they need to overlap with flat edges of wafer table when ware placed on.Therefore,a positioning and edge inspection method applied to silicon carbide grinding machines is proposed.This method first clamps the claw on the positioning platform for rough positioning,then rotates the silicon carbide chip to determine the flat edge of the chip through the edge detection sensor.Finally,it rotates to the set angle that exactly coincides with the carrier platform to complete the positioning and edge detection.This method maximizes the vacuum of the adsorbed wafer by overlapping the flat edge wafer with the flat edge wafer holder,greatly improving subsequent grinding accuracy.By comparing the grinding effects,TTV has increased from the original 4.4 μm up to 1.5 μm.
Silicon carbidePositioning and edge detectionGrinding accuracy
万方数据
维普
