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基于低粗糙度酸腐蚀片制备的精密研磨工艺研究

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讨论了精密研磨工艺对低粗糙度酸腐蚀片的影响,提出了采用细砂精密研磨的方式,并相应研究了精密研磨去除量、助磨剂加入量等参数对低粗糙度酸腐蚀片加工的影响.采用小粒径白刚玉研磨硅片可有效降低硅片的表面粗糙度,增加细砂研磨时助磨剂的加入量可有效减少划伤.
Research on Precision Grinding Process Based on Low Roughness Acid Corrosion Tablet Preparation
This article discusses the influence of precision grinding technology on low roughness acid corroded sheets,proposes the use of fine sand precision grinding method,and correspondingly studies the influence of parameters such as precision grinding removal amount and grinding aid addition amount on the processing of low roughness acid corroded sheets.Decreasing the particle size of the white corundum can effectively reduce the surface roughness of the wafers,and increasing the amount of grinding aids added during fine sand grinding can effectively reduce scratches.

Silicon waferGrindingLow roughness

王玉臣

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中国电子科技集团公司第四十六研究所,天津 300220

硅片 研磨 低粗糙度

2024

电子工业专用设备
中国电子科技集团公司第四十五研究所

电子工业专用设备

影响因子:0.157
ISSN:1004-4507
年,卷(期):2024.53(3)
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