SOI(Silicom-On-Insulator)wafer is a silicon wafer with a thin silicon film on an insulating oxide.In the process of SDB-SOI wafer preparation,it is necessary to conduct wafer bonding,grinding,polishing and other processes,through the bonding cavity,top silicon thickness,top silicon TTV,top silicon shape,top silicon surface and other parameters control,the difficulty of subsequent processing can be reduced,and high-quality products are finally prepared.
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