电子工业专用设备2024,Vol.53Issue(3) :49-54.

数组和结构体在PLC程序封装中的应用

Application of Arrays and Structures in PLC Program Packaging

赵乃辉
电子工业专用设备2024,Vol.53Issue(3) :49-54.

数组和结构体在PLC程序封装中的应用

Application of Arrays and Structures in PLC Program Packaging

赵乃辉1
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作者信息

  • 1. 中电科风华信息装备股份有限公司,山西 太原 030024
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摘要

在各种语言中经常会用到封装、继承等方法,但在PLC编程中,目前使用极少,需要将整段程序复制过来再单独更改每个软元件,效率低且容易出错.随着PLC编程软件封装功能的不断升级完善,同时借助结构体和数组的方式,可以将大量的信息直接传递给封装块内部,极大地提高了使用效率同时简化了编程.

Abstract

Encapsulation,inheritance,and other methods are often used in various languages,but they are currently rarely used in PLC programming.It is necessary to copy the entire program and change each software component separately,which is inefficient and prone to errors.With the continuous up-grading and improvement of PLC programming software packaging functions,a large amount of infor-mation can be transmitted to the interior of packaging blocks through structures and arrays,greatly simplifying programming and improving usage efficiency.

关键词

封装/数组/结构体

Key words

Encapsulation/Array/Structure

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出版年

2024
电子工业专用设备
中国电子科技集团公司第四十五研究所

电子工业专用设备

影响因子:0.157
ISSN:1004-4507
参考文献量2
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