Mathematical Simulation and Analysis of Double-sided Grinding Process for Silicon Wafers
Established a motion model of a point on silicon wafer surface relative to the grinding disc during the double-sided grinding process. Using mathematical software,simulate motion trajectories at different speeds. The trajectory and experimental results indicate that,while keeping the other double-sided grinding processes unchanged,changing the four recipes of the grinding machine (the revolution speed of the cruise plate ωh,the grinding plate speed ωp,the internal gear speed ωs and the external gear speed ωr). The rotational speed has a significant impact on the flatness of the silicon wafer surface,especially the local flatness of the edge parts. Optimizing four rotational speeds can significantly improve the surface smoothness and local smoothness of silicon wafers.
万方数据
维普
