Chemical mechanical planarization(CMP) needs to control wafer profile accurately in the pro-cess of copper. Precise tuning process control (PTPC) can detect the real-time copper thickness by sen-sor,and adjust head zone pressure by close-loop. This method realizes more uniform of copper film polish and profile control. The detection principle and control flow of PTPC system are introduced.
关键词
精确调整过程控制/闭环控制/压力/晶圆表面薄膜形貌
Key words
Precise tuning process control(PTPC)/Close-loop/Pressure/Wafer film profile
维普
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