Design of Visual and Mechanical Pre-alignment Methods for Bonded Wafer
In the exposure equipment,the pre-alignment first centers the wafer and aligns the angle, and the pre-aligned wafer is transmitted to the workbench in the same direction and position to ensure the stable operation of the equipment. In order to meet the pre-alignment requirements of bonding wafers,the pre-alignment structure is designed by means of visual and mechanical clamping,so as to obtain the compatibility of bonding wafers and ensure the stable operation of the equipment on bonding wafers.
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维普
