The key technology of wafer bonding is the thermal field design of the bonding equipment.In this paper,using a combination of finite element and experiment methods,a circular heating plate that can be used for wafer bonding is designed and trial-produced.The method of using uniform temperature plate and vacuum brazing effectively improves the heat conduction effect,achieving a TUS of no more than 1％ and a pressure bearing performance of 100 kN.
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