电子工业专用设备2024,Vol.53Issue(6) :20-26.

微米级Ag/Cu/Ni球形颗粒对Sn42Bi58焊料性能的影响

Influence of Micro Sized Ag/Cu/Ni Spherical Particles on the Properties of Sn42Bi58 Solder

万莉
电子工业专用设备2024,Vol.53Issue(6) :20-26.

微米级Ag/Cu/Ni球形颗粒对Sn42Bi58焊料性能的影响

Influence of Micro Sized Ag/Cu/Ni Spherical Particles on the Properties of Sn42Bi58 Solder

万莉1
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作者信息

  • 1. 上海电子信息职业技术学院,上海 201411
  • 折叠

摘要

研究了微米级银粉、镍粉和铜粉对Sn42Bi58 无铅焊锡膏的焊接性能影响.在实验过程中通过机械搅拌的方式添加金属粉末,明显改善Sn-Bi合金焊接头的焊接能力和力学性能.并对其组织与性能进行了研究,为低温无铅焊料的推广和产业化奠定了材料基础.

Abstract

The influence of micron sized silver powder,nickel powder,and copper powder on the soldering performance of Sn42Bi58 lead-free solder paste is studied.During the experiment,metal powder is added by mechanical stirring,which significantly improved the welding ability and mechanical properties of Sn Bi alloy welded joints.And its organization and properties are studied,laying the material foundation for the promotion and industrialization of low-temperature lead-free solder.

关键词

微米金属颗粒/锡铋合金/偏析/焊料

Key words

Micron metal particles/Tin bismuth alloy/Segregation/Solder

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出版年

2024
电子工业专用设备
中国电子科技集团公司第四十五研究所

电子工业专用设备

影响因子:0.157
ISSN:1004-4507
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