首页|面向高频通信的半导体材料微型天线集成技术

面向高频通信的半导体材料微型天线集成技术

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针对 5G及以上高频通信对天线小型化和集成度要求日益提高的问题,设计了一种基于氮化镓半导体材料的微型天线集成方案.通过天线结构优化和匹配网络设计,在GaN半导体基底上实现了天线与射频芯片的无缝集成.HFSS仿真结果表明,该集成方案在 30~40 GHz频段表现出优异的辐射性能,天线增益达到 6.5 dBi,驻波比小于 1.5.基于GaN材料平台的多层复合介质结构设计使天线尺寸仅为传统贴片天线的 1/3,在保持良好性能的同时实现了显著的体积缩减.研究成果为高频通信系统的小型化集成提供了可行的技术方案.
Integration Technology of Semiconductor Material-Based Miniature Antennas for High-Frequency Communications
Addressing the increasing demands for antenna miniaturization and integration in 5G and higher frequency communications,this paper presents an integrated miniature antenna solution based on gallium nitride(GaN)semiconductor materials.Through optimization of the antenna structure and matching network,an integrated design of the antenna with RF chips has been achieved.Experimental results demonstrate that the proposed integration solution exhibits excellent radiation characteristics in the 30-40 GHz frequency band,achieving an antenna gain of 6 dBi and a voltage standing wave ratio(VSWR)less than 1.5.Moreover,the antenna size is only one-third of a traditional patch antenna,providing a viable solution for miniaturized integration of high-frequency communication systems.

Miniature antennaSemiconductor integrationHigh-frequency communicationsGalli-um nitride(GaN)Matching network

马玉芳、赵秀龙

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国家知识产权局专利局专利审查协作天津中心,天津 300300

中航国际金网(北京)科技有限公司,北京 100000

微型天线 半导体集成 高频通信 氮化镓 匹配网络

2024

电子工业专用设备
中国电子科技集团公司第四十五研究所

电子工业专用设备

影响因子:0.157
ISSN:1004-4507
年,卷(期):2024.53(6)