Design of Flexible Vapor Chamber with Composite Vapor Channel and Study of Its Heat Transfer Performance
In recent years,with the development and progress of science and technology,various flexible electronic devices have been popularized.The ensuing doubling of power consumption has led to excessive heat flux and work temperature of electronic chips in a small space,causing severe heat dissipation problems.However,conventional vapor chambers are not suitable for flexible electronic devices because of its high rigidity.In order to solve these problems,a 2.2 mm thick flexible vapor chamber with a composite vapor channel is fabricated based on an aluminum-plastic film shell in this paper.The steady-state heat transfer performances under different injection volume,different gravity directions,different bending angles and times are tested.The results show that the best injection volume of the flexible vapor chamber is 700 µL,and its maximum thermal conductivity is 1264.9 W/(m·℃)under the heating power of 7 W,which is 4517.6 times of that of the shell material(aluminum-plastic film)itself.The flexible vapor chamber has good heat transfer performance.
flexible vapor chamberheat transfer performancecomposite vapor channel
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