Influence of Structural Parameters on the Bonding Wire Performance of Microwave RF Devices
As a key component of active phased array radar,the size and performance of microwave RF devices determine the performance of radar detection.Wire bonding is a commonly used interconnection technology for microwave RF devices.With the improvement of device integration,the size of bonding wires is becoming smaller and smaller.How to ensure high reliability of package is an urgent problem to be solved in the industry.A high-precision parameterized model for wire bonding interconnection structure is established in this paper.Through thermal and electrical simulation and the fatigue life prediction model,the thermal-mechanical-electrical analysis of different structural parameters on wire bonding process is conducted,and the sensitivity study on multiple parameters is also conducted.The results indicate that the four structural parameters have varying degrees of influence on the thermal fatigue life.The range of wire radius on thermal fatigue life is 14.891×10 5,which has the greatest impact on thermal reliability;the range of platform length on insertion loss is 0.733 2,which has the greatest impact on electrical performance.
wire bondingreliabilityfatigue life predictionelectrical performance
万方数据
维普
