Photothermal Performance of High-power White LED Packaged with Phosphor-in-silicone and Phosphor-in-glass
The primary packaging of high-power white LEDs(WLEDs)is divided into phosphor-in-glass(PiG)package and phosphor-in-silicone(PiS)package.We proposed a PiS packaging method to optimize the uniformity of the light-emitting surface of high-power WLEDs,and analyze the photothermal performance.The experimental re-sults show that the luminous flux of the WLED packaged by PiS is 576.07 lm at 1 400 mA,which is 15.5%higher than that of the WLED packaged by PiG.During the process of temperature increase from 25℃to 125℃,the lumi-nance of the PiS packaged device decreased by 20%,and the color temperature increased from 5 882.11 K to 6 024.22 K.The thermal resistance of the PiS package is 1.7 K/W at 25℃,which is close to that of the PiG pack-age.The relative light intensity of PiS package remains stable at 97%during 840 h of high temperature and high hu-midity aging and 1 600 h of high temperature aging test.
high power WLEDsPiGPiSphotothermal performancethermal performance
国家科技期刊平台
NSTL
万方数据
