激光照明应用MgO-La3Si6N11∶Ce3+复合荧光玻璃的制备及性能优化
Fabrication and Performance Optimization of MgO-La3 Si6 N11∶Ce3+Composite Phosphor-in-glass for Laser Lighting
徐涛 1邾强强 1王国娟 1翟玥 1张宏 1王乐1
作者信息
- 1. 中国计量大学 光学与电子科技学院,浙江 杭州 310018
- 折叠
摘要
荧光玻璃材料在激光照明领域具有良好的应用潜力,然而玻璃基质的低热导率特性导致其在工作条件下容易出现严重的热猝灭问题,进而降低发光性能.为了提升荧光玻璃的散热性能,本研究将高热导率MgO颗粒引入到了La3Si6N11∶Ce3+(LSN∶Ce3+)氮化物荧光玻璃中,制备获得了MgO-LSN∶Ce3+复合荧光玻璃材料.通过优化制备工艺、MgO含量以及玻璃厚度,具有最优综合性能的复合荧光玻璃在激光激发下的发光饱和阈值达到了2.08 W/mm2,比无MgO荧光玻璃样品(1.5 W/mm2)提高了38.7%,最高光通量也相应地提升了44.6%,从383 lm提高到了554 lm.同时,由于散射性能的提升,MgO-LSN∶Ce3+复合荧光玻璃的发光均匀性也得到显著优化.最后,通过进一步在复合荧光玻璃中引入红色发光的CaAlSiN3∶Eu2+(CASN∶Eu2+)荧光粉,并调节LSN∶Ce3+和CASN∶Eu2+之间的比例,可实现显色指数(Ra)达到85.5的高品质激光驱动白光光源.
Abstract
Phosphor-in-glass(PiG)materials have great potential in the field of laser lighting.However,the low thermal conductivity of the glass matrix leads to serious thermal quenching issues under working conditions,thus re-ducing the luminous performance.To improve the heat dissipation performance of PiG,high thermal conductivity MgO particles have been introduced into La3Si6N11∶Ce3+(LSN∶Ce3+)nitride PiG to create MgO-LSN∶Ce3+composite PiG.By optimizing the fabrication process,MgO content,and glass thickness,the composite PiG with the best com-prehensive performance achieved a luminescent saturation threshold of 2.08 W/mm2 under laser excitation,which is 38.7%higher than the MgO-free PiG sample(1.5 W/mm2).The maximum luminous flux also increased by 44.6%,from 383 lm to 554 lm.Furthermore,due to the improved scattering performance,the luminous uniformity of MgO-LSN∶Ce3+composite PiG was significantly optimized.Finally,by further introducing red-emitting CaAlSiN3∶Eu2+(CASN∶Eu2+)phosphors into the composite PiG and adjusting the ratio between LSN∶Ce3+and CASN∶Eu2+,a high-quality laser-driven white light source with a color rendering index(Ra)of 85.5 can be achieved.
关键词
激光照明/氮化物荧光粉/荧光玻璃/散热性能/发光均匀性Key words
laser lighting/nitride phosphor/phosphor-in-glass/heat dispersion/light uniformity引用本文复制引用
基金项目
国家自然科学基金(12274387)
国家自然科学基金(62075203)
国家自然科学基金(12104431)
浙江省重点研发项目(2022C01127)
出版年
2024