Influence of Copper Substrate Area,Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs
High power density LED device can achieve many functions that is the traditional light sources and ordinary LED devices cann't achieve,and it is pushing the LED lighting industry technology chain into a new level.In practical applications,the high power density LED needs to work at hundreds of watts and nearly 100 A current.The copper sub-strate area,solder tin and copper foil thickness will have a significant effect on the maximum light intensity,it is the most important indicator of this type LED.In this paper,we have welded the LEDs(300 W and 200 W,blue and white light)onto the thermoelectric separation copper substrates(Three diameters of the substrate:32 mm,25 mm,20 mm.Three solder tin thicknesses between the LED and the substrate:5 μm,100 μm,200 μm).The I-L and I-V curves of the blue and white light LEDs have been tested,under different radiator temperatures(25℃,50℃,75℃and 100℃,respectively).The I-L and I-V characteristics of the blue light LED devices with a maximum electrical power of 150 W were also studied when the conductive copper foil thickness of the copper substrate was 70 μm and 140 μm,respec-tively.And its maximum optical output was studied.The research results indicate that the thickness of solder tin,the area of copper substrate,and the thickness of conductive copper foil all have significant effects on the maximum luminous intensity and operating voltage of the LEDs.The decrease of solder thickness and the increase of copper substrate area can significantly improve the maximum light intensity of the LEDs,the increase of maximum blue light optical power of the P110 and T90 LEDs can reach up to 16%and 19%,the increase of the maximum luminous flux of the white light LEDs is about 15%,respectively.When the thickness of the copper foil increases from 70 μm to 140 μm,the maximum optical power increase of P70 blue LED is 9.2%when the heat sink temperature is 25℃,12.9%at 50℃and 75℃,and 16.4%at 100℃.
high power density LEDthermoelectric separation copper substratesoldering tinconductive copper foil
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