首页|NH3/N2复合热退火技术改善高浓度Mg掺杂GaN材料性能

NH3/N2复合热退火技术改善高浓度Mg掺杂GaN材料性能

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研究了NH3/N2复合热退火技术对高浓度Mg掺杂GaN材料晶体质量、发光性质及导电性能的影响.实验结果表明,相较于传统N2氛围高温热退火后处理工艺而言,NH3氛围高温热退火后处理工艺可以改善高浓度Mg掺杂GaN材料的晶体质量,同时可以增进Mg受主原子的有效掺杂,使得其光致发光谱中蓝光峰强度增强.采用NH3氛围高温热退火结合N2氛围低温热退火后处理工艺复合技术制备得到的高浓度Mg掺杂GaN材料内部背景电子浓度显著降低.这是由于在NH3氛围高温热退火后处理工艺中,NH3的热分解产物能够有效降低材料内N空位和间隙Ga原子等浅施主型缺陷浓度,最终改善高浓度Mg掺杂GaN材料的导电性能.
Enhanced Properties of Heavily Mg-doped GaN by Combining Thermal Annealing Processes in NH3/N2
The effect of a novel post-growth process,i.e.high-temperature thermal annealing process in NH3,on the crystal quality,luminescence property,and electrical conductivity of the heavily Mg-doped GaN was studied.The experimental results showed that,compared with the traditional high-temperature annealing process in N2,the high-temperature thermal annealing process in NH3 can improve crystal quality in the heavily Mg-doped GaN,while promote the further effective doping of Mg acceptors,resulting in an enhancement of the intensity of the blue luminescence band in its photoluminescence spectra.The heavily Mg-doped GaN with sig-nificantly lower background electron concentration was obtained by combining high-temperature thermal anneal-ing process in NH3 with low-temperature thermal annealing process in N2.This is because that the thermal de-composition products of NH3 in the post-growth process can effectively reduce the concentration of shallow do-nor-type defects such as N vacancies and interstitial Ga atoms in the material,ultimately improving electrical conductivity of the heavily Mg-doped GaN.

gallium nitrideMg dopedthermal annealingammonia

蒋宗霖、闫丹、张宁、魏同波、王军喜、魏学成

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中国科学院半导体研究所宽禁带半导体研发中心,北京 100083

中国科学院大学材料科学与光电技术学院,北京 100049

氮化镓 Mg掺杂 热退火工艺 氨气

国家重点研发计划国家自然科学基金

2022YFF070560062135013

2024

发光学报
中国物理学会发光分会,中国科学院长春光学精密机械与物理研究所

发光学报

CSTPCD北大核心
影响因子:1.301
ISSN:1000-7032
年,卷(期):2024.45(8)
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