Influence of process parameters on surface roughness of ultrasonic-assisted wire sawed monocrystalline silicon based on finite element method
In order to study the influence of ultrasonic vibration-assisted cutting of monocrystalline silicon on the surface roughness of silicon wafers,a two-dimensional simulation model of single abrasive grain cutting monocrystalline silicon was established by ABAQUS software,and the interaction between the surface roughness of monocrystalline silicon and the set wire-cutting process parameters was obtained by analyzing the simulation data by response surface method(RSM),and the influence of single abrasive grain on the surface roughness of monocrystalline silicon under different process parameters was studied.Results show that by es-tablishing a regression model to evaluate the relationship between surface roughness and process parameters,and optimizing the model,the optimal process parameters are as follows:ultrasonic frequency f=31 kHz,ul-trasonic amplitude A=10 μm,abrasive velocity vl=28 m/s,abrasive inclination angle θ=-15°,abrasive half cone angle φ=60°.
monocrystallineultrasonic vibrationfinite element simulationresponse surface methodregres-sion modelssurface roughness
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