In this paper, the wood flour(WF) of Pinus massoniana Lamb.were thermally treated at 180~220 ℃ for 0, 1, 2 and 3 h, respectively, then the thermally treated WF was mixed with HDPE to produce WF/HDPE composites (WPC).The decay resistance against the white-rot(Trametes versicolor) and brown-rot(Antrodia sinuosa) fungi, the flexural modulus of rupture and modulus of elasticity of the composites were investigated, and the microstructure of the composites before and after being infected by the 2 evaluated fungi were observed by environmental scanning electron microscope(ESEM).The results showed that thermal treatment temperature and time significantly influenced the mass loss rate (P<0.05), but the stains has no significant variation(P>0.05).It was observed that the mass loss rate of the composites made with WF heat treated all had a decreasing trends compared to reference samples, and their difference varied as the processing temperature increase and time lengthening, the mass loss rate of the composites made with WF treated at 200 ℃ for 3 h infected by T.versicolor and A.sinuosa were the lowest than the other treatments with a decrease rate 53.52% and 57.83% compared to CK, respectively.ESEM observation of fungi growth on the surface of composites before and after being infected by the two fungi also suggested that thermal treatment also improved the decay resistance against the fungi.The results of the flexural properties of the composites showed that the flexural modulus of rupture decreased after WF were treated with the biggest 4.57% decrease compared to reference samples, and the modulus of elasticity of the composites filled with heat-treated WF increased at first and then decreased with the increasing thermal treatment temperature and lengthening thermal treatment time.Thermal treatment temperature and time has no significantly influenced on the flexural modulus of rupture and the modulus of elasticity.
thermal treatmentwood flourwood-plastic compositesdecay resistance propertiesmass loss rateflexural strengthelastic modulus
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