多组分CuCrSn-X-Y合金制备工艺与组织性能研究
Study on the preparation process,microstructure and properties of multi-component CuCrSn-X-Y alloy
龚留奎 1冯宏伟 2宋士鑫 2刘晓彬 2冯斌 3黄伟2
作者信息
- 1. 中国兵器科学研究院宁波分院,浙江宁波 315103;宁波表面工程研究院有限公司,浙江宁波 315103
- 2. 中国兵器科学研究院宁波分院,浙江宁波 315103
- 3. 宁波兴敖达金属新材料有限公司,浙江宁波 315460
- 折叠
摘要
采用粉末冶金工艺制备多组分块体CuCrSnFeP、CuCrSnZrZn合金,对合金的烧结工艺、组织性能进行了探索和表征分析.结果表明,当烧结温度为950 ℃时,CuCrSnFeP合金的烧结密度随烧结时间的增加大致呈升高趋势,而CuCrSnZrZn合金的烧结密度整体起伏较大;当烧结温度为1 000 ℃时,CuCrSn-FeP合金的烧结密度整体略高于950 ℃,而CuCrSnZrZn合金的烧结密度略低于950 ℃;当烧结温度为1 050 ℃时,坯料外表出现粉末脱落的现象.1 000 ℃下烧结2 h是CuCrSnFeP合金的较优烧结工艺,其中Cu-0.65Cr-0.2Sn-0.05Fe-0.05P合金的烧结密度、硬度和导电率分别为8.79 g/cm3、91HV0.2和61%IACS,且烧结组织较为均匀,内部存在大量的退火孪晶,平均晶粒尺寸约为21.63 μm,Sn元素没有明显的团聚现象,弥散分布于基体中,而P元素和少量的Fe元素则偏聚于大颗粒Cr相的边缘,包裹富Cr相存在于铜基体中.此外,晶粒内部还存在一定数量的位错缠结.
Abstract
Multi-component bulk CuCrSnFeP and CuCrSnZrZn alloys were prepared by powder metallurgy tech-nology,and the sintering process,microstructure and properties of the alloys were explored and characterized.The results show that when the sintering temperature is 950 ℃,the sintering density of CuCrSnFeP alloy increas-es with the sintering time,while the sintering density of CuCrSnZrZn alloy fluctuates greatly. When the sintering temperature is 1 000 ℃,the overall sintering density of CuCrSnFeP alloy is slightly higher than 950 ℃,while the sintering density of CuCrSnZrZn alloy is slightly lower than 950 ℃. When the sintering temperature is 1050 ℃,there is a phenomenon of powder detachment on the surface of the billet. Sintering for 2 h at 1 000 ℃ is a better sintering process for CuCrSnFeP alloy,in which the sintering density,hardness and conductivity of Cu-0.65Cr-0.2Sn-0.05Fe-0.05P alloy are 8.79 g/cm3,91HV0.2 and 61%IACS,respectively. And the microstructure is relatively uniform,there are a large number of annealed twin inside,the average grain size is about 21.63 μm,Sn elements have no obvious agglomeration and are diffusely distributed in the matrix,while P elements and a small amount of Fe elements are biased at the edge of the large granular Cr phase and exist in the copper matrix. In ad-dition,there is a certain amount of dislocation entanglement inside the grains.
关键词
CuCrSn-X-Y/烧结/密度/硬度/导电率Key words
CuCrSn-X-Y/sinter/density/hardness/conductivity引用本文复制引用
基金项目
宁波市科技创新2025重大专项资助项目(2019B10083)
宁波市重点研发计划资助项目(2023Z100)
出版年
2024