Research progress on atomic scale of copper-aluminum layered composites
Cu/Al laminated composites are more and more widely used because of their high cost-effective syn-ergistic effect.However,the interface structure,microstructure of copper layer and aluminum layer of Cu/Al composites prepared by different process methods are different,and the mechanical properties are different.The difference in interface bonding characteristics leads to macroscopic quality problems such as dislocation,delamination,and copper layer surface tearing during deep processing,which seriously restricts its application in high-end fields.In this paper,the research status of atomic scale of copper-aluminum laminated composites is introduced.The research progress of molecular dynamics simulation on the interface layer structure,diffusion and solidification,the correlation between heterogeneous interface characteristics and mechanical properties of copper-aluminum laminated composites is reviewed.The advantages and disadvantages of different potential functions in molecular dynamics simulation of copper-aluminum laminated composites are analyzed.It is pro-posed that accurate model,reasonable force field and accurate parameters are the three basic criteria for material atomic scale simulation,which provides a reference for the study of atomic scale of metal laminated composites.
copper and aluminum laminated composite materialmolecular dynamicatomic scaleinterfacepotential function
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