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熔融石英陶瓷材料介电性能影响因素分析

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采用凝胶注模成型工艺制备熔融石英陶瓷,通过XRD、SEM和电性能网络分析仪对陶瓷样品的晶体结构、微观形貌、介电性能进行分析,研究了熔融石英陶瓷介电性能的影响因素,为筛选制备石英陶瓷材料最优工艺方案提供依据.研究结果表明:材料制备工艺一定时,制备不同厚度的石英陶瓷板,平铺烧结,同一块方板沿垂直方向自上而下,密度逐渐下降,密度与介电常数呈正相关,密度每上升0.01 g/cm3,介电常数对应上升0.01~0.02,密度对损耗角正切数值影响不大;同一块板同样厚度位置,边角与中间位置的密度几乎没有变化;同一块板,同样厚度方向,介电常数变化不大;石英陶瓷板中引入松香导致试样更致密,密度升高,介电常数随之增大;相同密度的试样,采用不同的介电测试方式计算所得的介电常数有约0.03的偏差.
Analysis of Influencing Factors on Dielectric Properties of Fused Quartz Ceramics
Fused silica ceramics were prepared by gel-casting molding process.The crystal structure,micro-morphology and dielectric properties of ceramic samples were analyzed by XRD,SEM and electrical network analyzer,and the influencing factors on dielectric properties of fused silica ceramics were studied to provide basis for screening the optimal preparation technology of fused silica ceramics.The results show that quartz ceramic slabs of different thicknesses are prepared and sintered horizontally with certain material preparation,the density of the same square slab decreases from top to bottom along the vertical direction,and the density has a positive correlation with the dielectric constant,for every 0.01 g/cm3 increase in density,the dielectric constant increases by 0.01~0.02.And the density has little effect on the tangent value of the loss angle.For the same slab of the same thickness,the density of the edge and the middle position barely unchanged.For the same slab and the same thickness direction,the dielectric constant does not change much.The rosin in the quartz ceramic slab makes the sample denser and the dielectric constant increases with the increase of the density,the calculated permittivity has a deviation of about 0.03.

fused silica ceramicsgel-casting moldingslab thicknessslab densityrosindielectric property

崔唐茵、王鹏、刘瑞祥、王洪升、曹俊倡、陈东杰

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山东理工大学材料科学与工程学院,淄博 255000

山东工业陶瓷研究设计院有限公司,淄博 255000

国防科技大学新型陶瓷纤维及其复合材料重点实验室,长沙 410073

熔融石英陶瓷 凝胶注模成型 坯板厚度 坯板密度 松香 介电性能

山东省自然科学基金山东省自然科学基金国防科工局国防科技重点实验室稳定支持科研项目国家自然科学基金

ZR2023ME035ZR2020ME027WDZC2021525050451802176

2024

硅酸盐通报
中国硅酸盐学会 中材人工晶体研究院

硅酸盐通报

CSTPCD北大核心
影响因子:0.698
ISSN:1001-1625
年,卷(期):2024.43(2)
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