首页|工艺参数对抛光渣轻质陶瓷砖性能的影响

工艺参数对抛光渣轻质陶瓷砖性能的影响

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  • 国家科技期刊平台
  • NETL
  • NSTL
  • 万方数据
近年来我国陶瓷行业发展迅速,每年产生约1 000万吨陶瓷抛光渣,但只有5％被利用.本文以陶瓷抛光渣作为研究对象,辅以球土、瓷片砂和中温砂等原料,以SiC为孔结构调控剂来制备轻质陶瓷砖,运用一系列正交试验得出最佳的烧结制度,并探究烧成温度与球磨时间对抛光渣轻质陶瓷砖的性能影响.结果表明,烧成温度的升高会改善轻质陶瓷砖内部连通孔和气孔均匀性,在1 160℃时,轻质陶瓷砖的体积密度、抗压强度、显气孔率最大,分别为1.24 g/cm3、35 MPa、20％,吸水率为20.38％;当球磨时间从10 min延长至110 min时,轻质陶瓷砖颗粒变细,表面能增大,液相量增多,发泡量增多,使连通孔、气孔均匀性得到改善.
Effects of Process Parameters on Properties of Polishing Slag Lightweight Ceramic Bricks
In recent years,Chinese ceramic industry has developed rapidly,producing about 10 million tons of ceramic polishing slag every year,but only 5％is used.The ceramic polishing slag was used as the research object,supplemented by raw materials such as clay,porcelain sand and medium temperature sand,and SiC was used as the pore structure regulator to prepare lightweight ceramic bricks.A series of orthogonal experiments were used to obtain the best sintering system,and explore the effects of firing temperature and milling time on performance of polishing slag lightweight ceramic bricks.The results show that an increase in firing temperature can improve the uniformity of internal connected pores and pores in lightweight ceramic bricks.At 1 160℃,volume density,compressive strength,and apparent porosity of lightweight ceramic bricks are the highest,and volume density is 1.24 g/cm3,compressive strength is 35 MPa and water absorption rate is 20.38％,respectively.When the ball milling time is extended from 10 to 110 min,the particles become finer,the surface energy increases,the liquid content increases,and the foaming content increases,resulting in improved uniformity of connected pores and pores.

ceramic polishing slaglightweight ceramic bricksintering processsintering temperatureball milling timecompressive strength

付思远、吕文欣、韦家崭、柯善军

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有色金属及材料加工新科技教育部重点实验室,桂林 541004

桂林理工大学有色金属矿产勘查与资源高效利用省部共建协同创新中心,桂林 541004

广西工业废渣建材资源利用工程技术研究中心,桂林 541004

广西欧神诺陶瓷有限公司,梧州 543307

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陶瓷抛光渣 轻质陶瓷砖 烧结工艺 烧成温度 球磨时间 抗压强度

广西科技重大专项广西光电材料重点实验室开放基金广西中青年教师基础能力提升项目广西建筑新能源与节能重点实验室开放基金广西重点研发计划项目

2020AA23001AA20AA-212020KY06022桂科能19-J-21-16桂科AB22035064

2024

硅酸盐通报
中国硅酸盐学会 中材人工晶体研究院

硅酸盐通报

CSTPCD北大核心
影响因子：0.698
ISSN：1001-1625
年,卷(期)：2024.43(4)
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