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碳化硅多孔介质内渗硅过程的仿真研究

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对仿真熔硅在碳化硅多孔预制体内的渗流过程进行深入研究,不仅有助于了解反应熔渗过程缺陷的成因,还有助于揭示特殊渗流现象的成因.本文基于水平集法、N-S方程、杨氏方程,在由光学显微镜图像提取重构的二维孔道内,进行了熔硅毛细熔渗过程的仿真,重点模拟了由40 μm颗粒经模压构成的预制体和基于颗粒级配工艺的预制体内的熔渗过程.结果表明:入渗过程中较大的入口有利于熔渗的快速进行,熔渗过程在同一区域由非饱和渗流逐步向饱和渗流演变;预制体内的大空腔、尖角区与盲孔等孔隙结构有较大概率演化出孔隙型缺陷;预制体的排气出口边界条件与熔渗趋肤成壳现象呈强相关性.
Simulation Studies on Silicon Infiltration Process in Porous Silicon Carbide Media
The in-depth study of infiltration process of simulated molten silicon in the porous preform of silicon carbide not only helps to understand the causes of defects in the reaction infiltration process,but also is of great significance to reveal thecauses of special infiltration phenomena.In this paper,based on level set method,N-S equation and Young's equation,the simulation of capillary infiltration process of molten silicon was carried out in the two-dimensional channel extracted and reconstructed by optical microscope image.The infiltration process of preform composed of 40 μm particles by molding and the preform based on particle gradation process was simulated.The results show that the larger inlet in infiltration process is conducive to rapid infiltration.The infiltration process gradually evolves from unsaturated infiltration to saturated infiltration in the same area.The pore structure of large cavity,sharp corner area and blind hole in preform will have a greater probability to evolve pore type defects.The boundary conditions of exhaust outlet of preform has a strong correlation with skin-forming phenomenon of infiltration.

silicon carbideinfiltration simulationmicroscopic channellevel set methodwettingN-S equation

张栩熙、张舸、包建勋、崔聪聪、郭聪慧、李伟、张巍、朱万利、徐传享、曹琪、董斌超、周立勋、李易霖

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中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室,长春 130033

中国科学院大学,北京 100049

中国科学院光学系统先进制造技术重点实验室,长春 130033

东北石油大学地球科学学院,大庆 163318

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碳化硅 渗流仿真 细观孔道 水平集法 润湿 N-S方程

2024

硅酸盐通报
中国硅酸盐学会 中材人工晶体研究院

硅酸盐通报

CSTPCD北大核心
影响因子:0.698
ISSN:1001-1625
年,卷(期):2024.43(9)