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核电系统用无机胶的研究进展

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胶黏材料作为核电站关键材料之一,在核电应用中扮演着至关重要的角色。相较于传统的有机胶,无机胶因优异的高温稳定性、耐辐照性、耐候性及低成本效益,在核电领域的应用中显示出独特的优势。本文首先概述了无机胶的组成、结构、分类及基本特性,随后详细探讨了磷酸盐无机胶与硅酸盐无机胶的粘接机理、改性策略及性能增强方法。研究表明:通过优化填料、引入交联剂和调整固化剂等方法,可以有效提高无机胶的耐高温性能;而通过调整固化工艺、进行界面优化和引入抗氧化剂等措施,则能显著提升无机胶的耐辐照性。此外,文章还介绍了无机胶应用技术的创新,如预加载技术、固化温度的调控及粘接界面的特殊处理。本文为无机胶在核电系统中的应用提供了新的视角和策略参考,有助于核电领域胶黏技术的发展。
Research Progress on Inorganic Adhesives for Nuclear Power System
Adhesive materials,as one of the critical materials in nuclear power plants,play a crucial role in nuclear applications.In comparison to traditional organic adhesives,inorganic adhesives exhibit unique advantages in the nuclear field due to their excellent high-temperature stability,radiation resistance,weather resistance,and cost-effectiveness.This paper firstly provides an overview of the composition,structure,classification,and basic characteristics of inorganic adhesives,followed by a detailed exploration of the bonding mechanisms,modification strategies,and performance enhancement methods of phosphate inorganic adhesives and silicate inorganic adhesives.Research indicates that by optimizing fillers,introducing cross-linking agents,and adjusting curing agents,the high-temperature resistance of inorganic adhesives can be effectively improved.Similarly,significant enhancements in radiation resistance can be achieved through adjustments in curing processes,interfacial optimization,and the introduction of antioxidants.Additionally,innovative applications of inorganic adhesives such as preloading techniques,control of curing temperature,and special treatment of bonding interfaces are discussed.This study provides new perspectives and strategic references for inorganic adhesives application in nuclear power system,thereby facilitating the development of adhesive technology in the field of nuclear power.

nuclear power systeminorganic adhesivephosphatesilicatebonding mechanismmaterial modificationtechnological innovation

李靖威、向恒、王晨

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生态环境部核与辐射安全中心,北京 100082

清华大学核能与新能源技术研究院,北京 100084

核电系统 无机胶 磷酸盐 硅酸盐 粘接机理 材料改性 技术创新

2024

硅酸盐通报
中国硅酸盐学会 中材人工晶体研究院

硅酸盐通报

CSTPCD北大核心
影响因子:0.698
ISSN:1001-1625
年,卷(期):2024.43(10)