Research Progress of Cu-based Composites Materials with A High Thermal Conductivity and A Low Expansion
The Cu-based composites with a high thermal conductivity and a low expansion are important electronic packaging materials.The preparation process of W/Cu,Mo/Cu,Invar/Cu,SiC/Cu,Cf/Cu,Diamond/Cu,and their thermal conductivity and thermal expansion properties are reviewed.Several theoretical models of the thermal conductivity and thermal expansion are analyzed.
万方数据
维普
