Research on the Effect of Current Density on the Morphology and Adhesion of Cyanide Free Electroplated Copper Coatings
Using cyanide-free copper plating solution LD-5101M,the effect of current density on the organization and morphology of iron-based copper plating layer and the bonding force was studied.The results show that:too high or too low current density is not conducive to the for-mation of the plating layer,when the current density is 1 A/dm2,the surface of the plating layer is the most detailed crystallization,the grain size is more uniform,which in turn shows that the surface of the plating layer is smoother and more even in the macroscopic sense;the full diffusion of the elements near the interface and the cathodic potential added to the specimen make the specimen to be reduced to the activated state are the main fac-tors of the plating layer has a good bonding force.
cyanide free copper platingcurrent densityorganizational morphologybinding force
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