The demand for materials with higher temperature resistance is increasing in the fields of aerospace,national defense,electronic devices and other industries.In order to further en-hance the temperature resistance of thermosetting polyimide materials,3,4'-oxydianiline(3,4'-ODA)was used as diamine,and 4-phenylethynylphthalic anhydride(4-PEPA)was used as the reactive end cap.A series of thermosetting polyimide materials with copolymerization were pre-pared by modifying asymmetrical 2,3,3',4'-diphenyl tetracarboxylic anhydride(a-BPDA)and 2,3,3',4'-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA).The chemical structure,ag-gregation state structure and thermal properties were characterized by infrared spectroscopy,X-ray diffraction and differential scanning calorimetry,respectively.The results indicate that the polyimide oligomers with a degree of polymerization of 6 have been successfully synthesized.The structure is amorphous,making it easily dissolved in organic solvents.At the same time,the glass transition temperature of the oligomers is 196-209 ℃,and the glass transition temperature of the cured resin is increased by 32 ℃ from 273 ℃ to 305 ℃.The paper provides a reference for the design and development of high-temperature-resistant polyimide resins.
关键词
热固性聚酰亚胺/共聚/不对称/耐高温
Key words
thermosetting polyimide/copolymerized/asymmetry/high temperature resistance
维普
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