Preparation and Properties of Copolymerized Thermosetting Polyimide Resins with High Temperature Resistance
The demand for materials with higher temperature resistance is increasing in the fields of aerospace,national defense,electronic devices and other industries.In order to further en-hance the temperature resistance of thermosetting polyimide materials,3,4'-oxydianiline(3,4'-ODA)was used as diamine,and 4-phenylethynylphthalic anhydride(4-PEPA)was used as the reactive end cap.A series of thermosetting polyimide materials with copolymerization were pre-pared by modifying asymmetrical 2,3,3',4'-diphenyl tetracarboxylic anhydride(a-BPDA)and 2,3,3',4'-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA).The chemical structure,ag-gregation state structure and thermal properties were characterized by infrared spectroscopy,X-ray diffraction and differential scanning calorimetry,respectively.The results indicate that the polyimide oligomers with a degree of polymerization of 6 have been successfully synthesized.The structure is amorphous,making it easily dissolved in organic solvents.At the same time,the glass transition temperature of the oligomers is 196-209 ℃,and the glass transition temperature of the cured resin is increased by 32 ℃ from 273 ℃ to 305 ℃.The paper provides a reference for the design and development of high-temperature-resistant polyimide resins.
thermosetting polyimidecopolymerizedasymmetryhigh temperature resistance
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