Adhesion Process and Hysteresis Simulation Analysis of Accelerometer
A study was conducted on a certain type of accelerometer,focusing on the adhesive layer curing process and curing stress.A bonding process model was established,and based on this,an accelerometer hysteresis simulation analysis was conducted to determine the influence of adhesive layer viscoelastic effect on the accelerometer hysteresis output.
accelerometeradhesive process modelcuring processviscoelasticity
万方数据
维普
