基于智能优化算法的PCB板电子元件条件热布局优化及仿真分析
Conditional Thermal Layout Optimization and Simulation Analysis of PCB Electronic Components Based on Intelligent Optimization Algorithm
舒红1
作者信息
- 1. 陕西工业职业技术学院,陕西咸阳 712000
- 折叠
摘要
针对PCB板电子元件的热布局优化问题提出一种基于智能优化算法的方法,对PCB板电子元件的热特性进行分析及建模,对其条件热布局的目标函数和约束条件进行限制,将智能优化算法引入热布局优化过程中,求得最优的元件布局方案,采用蚁群算法,通过对比实验验证方法的有效性,此结果对提高PCB板电子元件的热性能具有重要的理论和实际意义,可为同类问题的研究提供参考.
Abstract
According to the thermal layout optimization of PCB electronic components,the study proposes a method based on intelligent optimization algorithm,analyzes and constructs the model based on the thermal characteristics of PCB electronic components,limits the objective function and constraint conditions of conditional thermal layout,and introduces intelligent optimization algorithm into the thermal layout optimization process.The optimal component layout scheme is obtained,and the ant colony algorithm is used to verify the effectiveness of the method through comparative experiments.This result has important theoretical and practical significance for improving the thermal performance of PCB electronic components,and can provide reference for the research of similar problems.
关键词
智能优化算法/蚁群算法/PCB板电子元件/热布局Key words
Intelligent optimization algorithm/Ant colony algorithm/PCB board electronic components/Thermal dis-tribution引用本文复制引用
基金项目
陕西工业职业技术学院自然科学类一般项目(2023YKYB-005)
出版年
2024
NETL
NSTL
万方数据