This study discusses the application status and future prospects of polyimide adhesives in printed circuit board(PCB)manufacturing,including domestic and foreign research progress,special applications,adaptability to environmental standards and market dynamics.The technological innovation in the research of polyimide adhesives abroad is relatively remarkable,especially in the aspects of environmental protection performance and high temperature stability.Although China has made progress in traditional applications,material innovation and environmental protection application still needs to be improved.This paper identifies the differences between domestic and foreign research through comparative analysis,and proposes that domestic research should strengthen the integration of material innovation and environmental protection technology in the development of high-performance polyimide adhesives,so as to promote the sustainable development of PCB industry.
关键词
聚酰亚胺胶黏剂/印刷电路板制造/应用现状
Key words
Polyimide adhesive/Printed circuit board manufacturing/Application status
维普
万方数据